Showing 1 - 6 results of 6 for search 'FLUID MECHANICS', query time: 0.72s Refine Results
  1. 1
    Tribochemical Reactions on Cu-film Influenced by Mechanical Stresses in Chemical Mechanical Polishing
    by Junne-Dar Chern, 陳俊達
    Published 2000
    “...碩士 === 國立成功大學 === 機械工程學系 === 88 === Tribochemical Reactions on Cu-film Influencedby Mechanical...”
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  2. 2
    Theoretical analysis and experiments for the tribological performances of slurry flow with micro particles in chemical mechanical polishing for wafers
    by Lu-Shen Chang, 呂聖章
    Published 2000
    “... polishing powders in CMP and it is no longer suitable to analyze by classical fluid mechanics. The effects...”
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  3. 3
    Theoretical and Experiments for Analysis the Tribochemical Reactions on Cu-film Influenced by Displacement Energy in Chemical Mechanical Polishing
    by Yi-Ming Chen, 陳宜銘
    Published 2001
    “...碩士 === 國立成功大學 === 機械工程學系 === 89 === The removal rate of Chemical Mechanical Polishing...”
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  4. 4
    Theoretical Analysis and Experiments for the Tribochemical Reactions on Cu-film Influenced by Abrasive Aggregation in Chemical Mechanical Polishing
    by Yan Xing Shen, 沈彥行
    Published 2001
    “... of the copper Chemical mechanical Polishing (CMP) from the viewpoint of chemical reaction in chief...”
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  5. 5
    The Theoretical Analysis for the Effect of porous structure of pad on the Slurry Flows and Tribological Performances Arising at the Chemical Mechanical Polishing of Cu-Film Wafers
    by Mow-Ren Tzeng, 曾茂仁
    Published 2005
    “... of porous structure to both of the flow field and the contact mechanism among wafer, slurry, and pad...”
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  6. 6
    Theoretical Analysis and Experiments for the Effect of Pad Pattern on the Slurry Flows and Tribological Performances Arising at the Chemical Mechanical Polishing of Cu-Film Wafers
    by Sheng-Jau Chen, 陳昇照
    Published 2003
    “...碩士 === 國立成功大學 === 機械工程學系碩博士班 === 91 === In Chemical Mechanical Polishing (CMP), the material...”
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