“...) system to investigate the fracture behavior and mechanism of four different kinds of solder joints: Sn-37...”
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“.... The mechanical properties of Ni-P were surveyed and the utility of Ni-P was identified as a diffusion barrier...”
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“.... It is expected to have an in depth understanding to the mechanical property and deformation behavior of this 5-e...”
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“... the mechanical and electrical properties of solder bumps produced with solder paste by printing. The shear...”
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“... investigated the mechanical properties and fracture behaviors with respect to saccharin addition and thus...”
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“... and failure mechanism of solder bumps produced by electroplating after different kinds of reliability tests...”
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“..., and the USS decreased to 22.4-24.8MPa after solder joints aged at 250℃ for 36 hours. The fracture of solder...”
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“...-Cu-P deposit by adding saccharin in the deposition solution. The stress relief mechanism was also...”
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“... compound AlxNiy. Meanwhile, the shear fractured solder bump exhibits stepwise appearance. After assembly...”
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