“... package due to the CTE mismatch between die, substrate, and bump using various underfill materials...”
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“... assembly of FCBGA which is rearranged by the strip size and then add molding. The FCBGA product is in a...”
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“... electronic products as well as the wireless communication industry vigorous development, portability...”
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“... of wafer-level chip scale package (WLCSP), a thin coating of film-like material; usually a type of photo...”
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“... methodology and John's Macintosh Product (JMP) based on auto-optical inspection and x-ray inspection with long...”
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“... in bumping packaging. The laser direct writing system utilized a KrF excimer laser source of 248nm...”
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“...碩士 === 國立高雄大學 === 電機工程學系碩士班 === 103 === Today wire bonding most important process in IC package...”
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“... the failure mode of flux residual in wafer level chip scale package (WLCSP) process, and to develop process...”
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“.... As the electronic package become thinner and smaller, the high power and high speed circuit filled in small body...”
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