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MOULD AND DIE DESIGN
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Rong-Sheng Chen
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MOULD AND DIE DESIGN
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Optimal
Design
of Fatigue Life for Quad Flat No Lead Package by Using Taguchi Method
by
Chia-Hao Chang
,
張家豪
Published 2007
“
... frame filled with an epoxy
mould
compound, and connecting to PCB through the solder paste , QFN has...
”
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