Showing 1 - 7 results of 7 for search '"Solder Bump"', query time: 0.75s Refine Results
  1. 1
    UBM Formation on Single Die/Dice for Flip Chip Applications
    by Jittinorasett, Suwanna
    Published 2014
    Subjects: “...Solder Bump...”
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  2. 2
    Planar Packaging and Electrical Characterization of High Temperature SiC Power Electronic Devices
    by Yue , Naili
    Published 2014
    Subjects: “...solder bump...”
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  3. 3
    Analysis and modeling of underfill flow driven by capillary action in flip-chip packaging
    by Wan, Jianwu
    Published 2005
    Subjects: “...Solder Bump Resistance...”
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  4. 4
    Quality inspection and reliability study of solder bumps in packaged electronic devices: using laser ultrasound and finite element methods
    by Yang, Jin
    Published 2009
    Subjects: “...Solder Bump...”
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  5. 5
    Quality assessments of solder bump interconnections in ball grid array packages using laser ultrasonics and laser interferometer
    by Gong, Jie
    Published 2016
    Subjects: “...Solder bump...”
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  6. 6
    Development of convective reflow-projection moire warpage measurement system and prediction of solder bump reliability on board assemblies affected by warpage
    by Tan, Wei
    Published 2008
    Subjects: “...Solder bump...”
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  7. 7
    Experimental and theoretical study of on-chip back-end-of-line (BEOL) stack fracture during flip-chip reflow assembly
    by Raghavan, Sathyanarayanan
    Published 2016
    Subjects: “...Lead-free solder bumps...”
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