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1by Edward R. T. TiekinkSubjects: “...secondary bonding...”
Published 2020-06-01
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4by Firudin I. Guseinov, Mikhail F. Pistsov, Eldar M. Movsumzade, Leonid M. Kustov, Victor A. Tafeenko, Vladimir V. Chernyshev, Atash V. Gurbanov, Kamran T. Mahmudov, Armando J. L. PombeiroSubjects: “...tetrel bonding...”
Published 2017-10-01
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7by Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Seiichi Takamatsu, Toshihiro Itoh, Eiji HigurashiSubjects: “...wafer bonding...”
Published 2020-04-01
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12by Carounanidy Usha, Sathyanarayanan Ramarao, Bindu Meera John, Praveen Rajesh, S SwathaSubjects: “...dry enamel bonding...”
Published 2017-01-01
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14by Adriana Oliveira Carvalho, Marcelo Tavares de Oliveira, Toru Nikaido, Junji Tagami, Marcelo GianniniSubjects: “...Dentin-Bonding Agents...”
Published 2012-10-01
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15by Quiery, Nuala Patricia JosephineSubjects: “...Parent-child bondingChild-parent bonding...”
Published 1996
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17by Jianchao Han, Hui Niu, Sha Li, Zhongkai Ren, Yi Jia, Tao Wang, A. I. Plokhikh, Qingxue HuangSubjects: “...Cold rolling bonding...”
Published 2020-10-01
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19by Koki Tanaka, Wei-Shan Wang, Mario Baum, Joerg Froemel, Hideki Hirano, Shuji Tanaka, Maik Wiemer, Thomas OttoSubjects: “...wafer bonding...”
Published 2016-12-01
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