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1“... in development the precise ceramic molded technique of shoes mold regulation technology and promotion shoes mold...”
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2by 洪茂傑“... a computational model to empirically discuss the correlation between efforts on innovation...”
Published 2008
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3“...碩士 === 國立臺灣大學 === 土木工程學研究所 === 104 === In this research, a numerical model for microstructure...”
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4“... model of the hybrid ceramic ball bearing is constructed with SolidWorks software, and the image format...”
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5“...碩士 === 國立臺灣科技大學 === 工程技術研究所材料科技學程 === 88 === The Pb1-xCaxTiO3（PCT）ceramics show many excellent...”
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6“...碩士 === 中原大學 === 化學工程研究所 === 95 === Air plasma spraying process was wildly used to produce ceramic...”
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7“... traditional ceramic compact and processes before sintering. Ultilizing four-axis machining of CAD(Computer...”
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8“... competition, actively promoting the technology of computer-assisted research and development projects...”
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9“... of computational modeling. In the casting experiment, the aluminum casting sample in the outlet region of the foam...”
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10“... model. The analysis result of this paper will provide proposal for improving efficiency of ceramic...”
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11“...碩士 === 朝陽科技大學 === 工業工程與管理系碩士班 === 91 === Ceramic dielectric powder is a very important raw material...”
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12“...碩士 === 國立臺灣師範大學 === 工業教育研究所 === 91 === This thesis proposed a fuzzy differentiable cerebellar model...”
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13“... with integrating Fuzzy Logical Controller (FLC) with Differentiable Cerebellar Model Articulation Controller (DCMAC...”
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14“... simulation. Computational models are more flexiblein their application than...”
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15“... process. Current ceramic capacitor cutting operation uses program algorithms and computer...”
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16“.... They consist of a metal resonator, which is stimulated by piezoelectric ceramics to produce oscillations...”
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17by 鄭銘翔“.... The reliability analysis was combined with FEA to predict the failure probability of the ceramic restoration. A...”
Published 2004
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18“... to the piezoelectric wire bonder of three kinds of different model. There are including the best sport posture or mode...”
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19“...) are not required to use any tool and model, through computer-aided design (CAD) to design out the use of 3D...”
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20“... to the size 0201 (0.024 inch L X 0.011 inch W), smaller than a grain of sesame, Multilayer Ceramic Chip...”
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