“... warpage typically occurs after the post-mold curing process as a result of mold compound curing shrinkage...”
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“... during the surface mount solder reflow process and compared to experimental shadow Moiré measurements...”
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“... the interconnect is subjected to either thermal or mechanical loads from manufacturing process or during service...”
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“... the post-mold curing process partically due to the CTE mismatch among various packaging constituents...”
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“... package-on-package (PoP) device during solder reflow process. The numerical results are compared to shadow...”
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“... packages for encapsulating the Si die. During packaging thermal processes, the thermal expansion mismatch...”
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