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    Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
    by Ai Ting Tan, Ai Wen Tan, Farazila Yusof
    Published 2015-06-01
    “... nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported...”
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