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  1. 221
    Small signal characterisation and temperature analysis of HBTs and pHEMTs using IC-CAP
    by Chitrashekaraiah, Sunil
    Published 2007
    “..., and shorter time-to-market. RF and microwave monolithic ICs with Heterojunction Bipolar Transistors (HBTs...”
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  2. 222
    An Area-Efficient 10-Bit Buffer-Reused DAC for AMOLED Column Driver ICs
    “... organic light-emitting diode (AMOLED) driver integrated circuits (ICs). In our design, we implement...”
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    Article
  3. 223
    A Green-Mode Pulse Width Modulation System for AC/DC Combo IC
    by Hua-Ming Lu, 呂驊洺
    Published 2008
    “... devices with whole combo control IC, it will efficiently reduce the volume and weight of the power supply...”
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  4. 224
    The fabrication of capacitive accelerometer by surface micromachining
    by Chen, Ching-Feng, 陳慶蘴
    Published 1998
    “... in Taiwan. Capacitive accelerometer was designed and fabricated. The polysilicon film...”
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  5. 225
    Experimental study on waste heat recovery from an IC engine using thermoelectric technology
    by Kumar Ramesh C., Sonthalia Ankit, Goel Rahul
    Published 2011-01-01
    “...A major part of the heat supplied in an IC engine is not realized as work output, but dumped...”
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    Article
  6. 226
    EMC Adhesion Effects of Sandblasted and Electrical-Discharge-Machined Surface on IC Encapsulation Mold
    by Shan-YuHsu, 徐善宥
    Published 2010
    “...碩士 === 國立成功大學 === 工程科學系碩博士班 === 98 === In IC packaging, when epoxy molding compound (EMC) is filled...”
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  7. 227
    Fabrication of Electroacoustic Devices for Integrated Applications
    by Enlund, Johannes
    Published 2009
    “.... The IC compatible fabrication technique of thin film electroacoustic devices has so far provided a...”
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    Doctoral Thesis
  8. 228
    Simultaneously Considering Layout Area and TSV Wire Length on TSV Placement for 3D IC
    by Huang, Wen-Shian, 黃玟賢
    Published 2012
    “... and Through Silicon Vias (TSV) technology become increasingly important. On the same circuit design, 3D IC...”
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  9. 229
    SiGe BiCMOS RF ICs and Components for High Speed Wireless Data Networks
    by Svitek, Richard M.
    Published 2014
    “... on-chip integration. The first part of this dissertation presents the design, fabrication...”
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  10. 230
    Research on the competition of the IC industry in the latter stage of testing and processing - Take P company as an example
    by YANG, SHIH-YANG, 楊世仰
    Published 2019
    “... all aspects of IC design, wafer fabrication, IC packaging, and IC testing. Together...”
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  11. 231
    Smart nanocrystals of artemether: Fabrication, characterization, and comparative in vitro and in vivo antimalarial evaluation
    Subjects: “...IC50...”
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    Article
  12. 232
    The Switch Devices of 3D IC for Memory and High Dielectric Constant for SiGe Transistors
    by Wei-Hung Liu, 劉韋宏
    Published 2009
    “... fabricated by a continuous process on single-crystal silicon wafers. In order to improve the design of device...”
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  13. 233
    Design and validation of innovative integrated circuits and embedded systems for neurostimulation applications
    by Castelli, Jonathan
    Published 2017
    Subjects: “...Analog IC design...”
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  14. 234
    Design of an Optical Transparent Absorber and Defect Diagnostics Analysis Based on Near-Field Measurement
    “... leakage, herein, an optical transparent radar absorbing structure (RAS) was designed using transparent...”
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    Article
  15. 235
    Improving Web Fabrication Yield with Expert Knowledge
    by Chih-Hung Tu, 凃志宏
    Published 2019
    “... and more largely and faster in Taiwan in the recent years, ranging from IC design and wafer fabrication...”
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  16. 236
    Fabrication and Characterization of Silicon JFET Pressure Sensor
    by Hsich, Mei-Kuan, 謝梅寬
    Published 1997
    “.... Ongoing advances in IC fabrication technology, semiconductor pressure sensors have...”
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  17. 237
    Fabrication of the SAW device and its application to biosensing
    by Ching-Feng Lee, 李清鋒
    Published 2004
    “... of small volume, lightness, low costs, high IC-compatibility, and better filtering performance. Different...”
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  18. 238
    <inline-formula> <tex-math notation="LaTeX">$W$ </tex-math></inline-formula>-Band Mixer With High Image Rejection by Mismatch Compensation Using Buffer Amplifier
    by Wonseok Choe, Sosu Kim, Wansik Kim, Jinho Jeong
    Published 2020-01-01
    Subjects: “...IC...”
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    Article
  19. 239
    Fabrication technique and characterization of silicon nanowire device
    by Kai-Shyang You, 游凱翔
    Published 2004
    “... progress in integrated circuits (IC) fabrication technology, to fabricate nanometer scale devices were...”
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  20. 240
    Study of the Extended Gate Field Effect Transistor (EGFET) and Signal Processing IC Using the CMOS Technology
    by Yuan-Lung Chin, 覃永隆
    Published 2001
    “... fabrication into one chip, the EGFET, p-n diode and readout circuits were produced using a CMOS standard IC...”
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