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  1. 261
    A Study Of Flate Leadframe Packaging By Way Of Dram Package
    by TSAI KAO, 高才
    Published 2008
    “..., thin, short, small, full-function" and other requirements, Plastic Ball Grid Array (PBGA) package has...”
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    Others
  2. 262
    Bandwidth enhanced antennas for mobile terminals and multilayer ceramic packages
    by Komulainen, M. (Mikko)
    Published 2009
    Subjects: “...package integration...”
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    Doctoral Thesis
  3. 263
    Integrated multi-mode oscillators and filters for multi-band radios using liquid crystalline polymer based packaging technoloy
    by Bavisi, Amit
    Published 2006
    “... system-on-package (SOP) design methodology. Silicon-based integrated circuits (ICs) provide an economical...”
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    Others
  4. 264
    Chip-last embedded low temperature interconnections with chip-first dimensions
    by Choudhury, Abhishek
    Published 2011
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  5. 265
    Electromagnetic coupling in multilayer thin-film organic packages with chip-last embedded actives
    by Sankaran, Nithya
    Published 2012
    Subjects: “...Mutlilayer organic packages...”
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  6. 266
    Conception en vue du Test des Circuits Intégrés 3D à base de TSVs
    by Fkih, Yassine
    Published 2014
    Subjects: “...Circuit intégré 3D...”
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  7. 267
    Modeling challenges and potential solutions for integration of emerging DERs in DMS applications: power flow and short-circuit analysis
    Subjects: “...Short-circuit modeling...”
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    Article
  8. 268
    Very large scale integrated circuit (VLSI) of a neurohardware processor implementing the kohonen neural network algorithm
    by Rajah, Avinash
    Published 2005
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    Thesis
  9. 269
    Enhanced accuracy time domain reflection and transmission measurements for IC interconnect characterization
    by Smolyansky, Dmitry A.
    Published 2012
    Subjects: “...Integrated circuits -- Reliability -- Measurement...”
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  10. 270
    Remplissage en polymère des via traversant (TSV) pour des applications 3D-Wafer Level Packaging
    by Bouchoucha, Mohamed
    Published 2013
    Subjects: “...Intégration 3D...”
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  11. 271
    Effects of varying the through silicon via liners thickness on their hoop stresses and deflections
    by Juma Mary Atieno, Xuliang Zhang, He Song Bai
    Published 2017-03-01
    Subjects: “...three-dimensional integrated circuits...”
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    Article
  12. 272
    Refining The Package Processing and Material Analysis for Wafer Level Chip Scale Package
    by Chen, Yung-Wei, 陳詠偉
    Published 2016
    “...碩士 === 國立交通大學 === 理學院應用科技學程 === 104 === Wafer level package is one of the advanced integrated...”
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    Others
  13. 273
    Computation of Maximum Voltage Droop in Power Delivery Networks
    Subjects: “...Integrated circuit (IC)...”
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    Article
  14. 274
    Modeling, design, and characterization of through vias in silicon and glass interposers
    by Bandyopadhyay, Tapobrata
    Published 2012
    Subjects: “...Integrated circuits...”
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  15. 275
    Development and integration of silicon-germanium front-end electronics for active phased-array antennas
    by Coen, Christopher T.
    Published 2013
    Subjects: “...Radio frequency integrated circuits...”
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  16. 276
    Microfabrication and Integration of a Sol-Gel PZT Folded Spring Energy Harvester
    Subjects: “...packaging...”
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    Article
  17. 277
    Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies
    by Ralston, Parrish Elaine
    Published 2014
    Subjects: “...electronics packaging...”
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    Others
  18. 278
    Research on Image Smoothing Diffusion Model With Gradient and Curvature Features
    by Dan Huang, Yueming Hu
    Published 2019-01-01
    Subjects: “...flexible integrated circuit substrate image...”
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    Article
  19. 279
    Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation
    by Seonho Seok
    Published 2021-08-01
    Subjects: “...biocompatible packaging...”
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    Article
  20. 280
    Signal to power coupling and noise induced jitter in differential signaling
    by Chandrasekhar, Janani
    Published 2008
    Subjects: “...Interconnects (Integrated circuit technology)...”
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