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81by Menezes, GarySubjects: “...Interconnects (Integrated circuit technology)...”
Published 2014
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82by Carastro, Lawrence A.Subjects: “...Integrated circuits Passivation...”
Published 2007
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83by Alberto Campos-Zatarain, Jack Hinton, Maria Mirgkizoudi, Jing Li, Russell Harris, Robert W. Kay, David FlynnSubjects: “...integrated circuit packaging...”
Published 2019-04-01
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Article -
84by Peter Gillingham, David Chinn, Eric Choi, Jin-Ki Kim, Don Macdonald, Hakjune Oh, Hong-Beom Pyeon, Roland SchuetzSubjects: “...high speed integrated circuits...”
Published 2013-01-01
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85by Sundaram, VenkateshSubjects: “...Interconnects (Integrated circuit technology)...”
Published 2009
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86by Weerasekera, RoshanSubjects: “...Signal Integrity...”
Published 2008
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Doctoral Thesis -
87“..., the miniature chip area of integrated circuit chip becomes more valuable, and the circuit designers always try...”
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88by Shiang, Jyue-Jon, 1956-Subjects: “...Integrated circuits -- Very large scale integration -- Packaging....”
Published 1987
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91by Liu, XiSubjects: “...Three-dimensional integrated circuits...”
Published 2014
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92by Figg, P. G.Subjects: “...Integrated circuits--Design and construction....”
Published 2012
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95by Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, Steve Voges, Ruben Kahle, Marc Dreissigacker, Martin Schneider-RamelowSubjects: “...fan-out wafer level packaging...”
Published 2019-05-01
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96by Yi, Yang“... for high frequency circuits and packages. 1) Multiple dielectrics are common in integrated circuits...”
Published 2011
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97by Lacy, William StephenSubjects: “...Integrated circuits Very large scale integration...”
Published 2007
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99by Mehrotra, GauravSubjects: “...Interconnects (Integrated circuit technology)...”
Published 2008
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100by Băjenescu, Titu-Marius I.“... some actual problems and reliability challenges in 3D IC packaging technology. It shows how different...”
Published 2020-03-01
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Article