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101Modeling of Simultaneous Switching Noise in On-Chip and Package Power Distribution Networks Using...by Mao, JifengSubjects: “...Three dimensional integrated circuits...”
Published 2005
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102by Fredin, Z, Zemanek, J, Blackburn, C, Strand, E, Abdel-Rahman, A, Rowles, P, Gershenfeld, NGet fulltext
Published 2021
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103“...碩士 === 國立清華大學 === 電機工程研究所 === 83 === The design of power integrated circuits (PIC) is strongly...”
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104by Kacker, KaranSubjects: “...Interconnects (Integrated circuit technology)...”
Published 2009
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105
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106
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107“... the integrated circuit foundries of Taiwan and the packaging and testing of integrated circuit industry in Taiwan...”
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108by Joachim N. Burghartz, Golzar Alavi, Bjorn Albrecht, Thomas Deuble, Mourad Elsobky, Saleh Ferwana, Christine Harendt, Yigit Mahsereci, Harald Richter, Zili YuSubjects: “...Hybrid integrated circuits...”
Published 2019-01-01
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110by Yurt, Abdulkadir“...Thesis (Ph.D.)--Boston University === The semiconductor industry continues to scale integrated...”
Published 2015
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111by Samanta, Rupak“... of operation and excessive leakage power. Moreover, the circuits are usually over-designed to compensate...”
Published 2010
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112“... and capability of machines as well as the capacity of kits is developed for integrated circuit (IC) packaging...”
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113“... for integrated circuits (IC) and microelectromechanical system (MEMS) devices. In this method, two wafers were...”
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114by Addington, J. ShawnSubjects: “...packaging...”
Published 2014
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115by Parker, Bruce Howard“... of choosing the correct impedances for both the lines and devices within the integrated circuit package...”
Published 1994
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116by 周美芬“..., circuit behaviors, schematic designs to package models as well as multi-process integration. Direct...”
Published 2005
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117“... detection mode of I/O port in this thesis and it can be used for the IC package processing. This mode...”
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118“... and property of the device. And how noise applied to design the RF circuits. First, the noise figure to LNA...”
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119“... integrated circuits. This paper presents a concept of MEMS sensors and microcontroller unit(MCU) can...”
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120“...) integrated circuits, conventional slab waveguides, and photonic/electronic integration are discussed...”
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