Showing 1,281 - 1,300 results of 1,495 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 1.37s Refine Results
  1. 1281
    ... to the reliability of the circuit, which typically decreases when the circuit area increases. By integrating...
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  2. 1282
  3. 1283
    ...We describe the “FishCam”, a low-cost (<500 USD) autonomous camera package to record videos...
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  4. 1284
    by Ming-Chou Huang, 黃敏洲
    Published 2009
    ...碩士 === 開南大學 === 資訊及電子商務學系 === 97 === Since the complexity of Very Large Scale Integration (VLSI...
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  5. 1285
    by Jia-Hung Shiu, 許嘉紘
    Published 2011
    ... grounding guard traces is the common solution in the printed circuit board or package. Because the board...
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  6. 1286
    by M. R. HAIDER, S. K. ISLAM, M. ZHANG
    Published 2007-10-01
    .... Package pin of the fabricated circuit is used as an antenna and measurement results demonstrate...
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  7. 1287
    by Lai, Po-Ying, 賴柏穎
    Published 2018
    ... in connecting an integrated circuit to a substrate for transmitting signals and power. The connecting wires...
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  8. 1288
  9. 1289
    by Gwo-Haw Wang, 王國驊
    Published 2004
    ... for the specific microsystem fabrication. The PCB-based system is designed that integrates electronic circuits...
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  10. 1290
    .... For the production phase, printed circuit boards and integrated circuits contribute over 70% of the total global...
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  11. 1291
    by Hsu, Po-Yang, 許博揚
    Published 2014
    ... within small areas. Furthermore, the modern integration technology such as system in package (SIP...
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  12. 1292
    by Kim, Joonsoo, Ph. D.
    Published 2012
    .... They find measurable physical characteristics that are unique to each integrated circuit. Among them...
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  13. 1293
    by Jia Shian Lin, 林家賢
    Published 2007
    .... In this thesis, we develop a CMOS compatible transducer design with the ability of integrating stimulation...
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  14. 1294
    by Joey Lai, 賴炯屹
    Published 2009
    ... of integration to the horizontal type since the Integrated Circuit (IC) technology started in 1959. Until 1900...
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  15. 1295
    by Yu-Jen Chen, 陳郁仁
    Published 2013
    ... is only about 10 μm in three-dimensional integrated circuits (3D IC). The volume of a solder joint shrinks...
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  16. 1296
    by Zheng, Li
    Published 2016
    ...) simulator is developed based on distributed circuit models for on-die power/ground grids, package- and board...
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  17. 1297
    by 陳佑祿
    Published 1997
    ...碩士 === 中原大學 === 機械工程學系 === 85 ===   IC plastic packages have become one of the most important...
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  18. 1298
    by Bester, Duane
    Published 2015
    .... This was achieved utilizing a Quest HavPro vibration monitor with a fitted tri-axial Integrated Circuit...
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  19. 1299
  20. 1300
    ... found to be integrated and tested lower and higher order cognitive levels according to Bloom’s taxonomy...
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