Showing 1,321 - 1,340 results of 1,495 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.31s Refine Results
  1. 1321
    by Blanch, Jorge
    Published 2003
    ... such a platform involved selection of hardware, circuit integration and software development...
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  2. 1322
    by Hsin-Jie Chen, 陳欣傑
    Published 2001
    ... integrity, and the methods of reducing the interference noise are studied. Second, the switching noise can...
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  3. 1323
    by Shih-Jan Luo, 羅士展
    Published 2013
    ... mobility Ge MOSFETs are the high-k integration process, the improvement of n-type dopants activation...
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  4. 1324
    by PENHARLOW, DAVID
    Published 1990
    ... microminiature PCM distributed data acquisition system with integral signal conditioning (MMSC) which has been...
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  5. 1325
    by Tzu Hsiang Lin, 林子翔
    Published 2014
    ..., the devices on the wafer are getting smaller, the integration of the circuits will increase reduces the cost...
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  6. 1326
    ... for resolving patent issues, that is so-called patent dance, Federal Circuit said that parties were...
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  7. 1327
    by Jing-cheng Lin, 林金成
    Published 2008
    ... circuits. The system is simulated by the software package SIMetrix/SIMPLIS to verify the analysis...
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  8. 1328
    by Varghese, Ronnie Paul
    Published 2015
    ... of scale. The miniaturization of energy harvesters permit them to be integrated as the power supply...
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  9. 1329
    by Chin-Chung Lo, 羅志忠
    Published 2005
    ... and analysis material crack growth forecast model。In package or system internal,integration thermal stress...
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  10. 1330
    by Liang-Ji Zheng, 鄭喨繼
    Published 2008
    ... improve the phase noise. Finally, we will integrate the CMOS chip and BCB package by flip-chip technology...
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  11. 1331
    by Y. H. Lee, 李仰涵
    Published 2004
    ... conversions-are the most fashionable topology in a transceiver because of the integration. Undoubtedly, CMOS...
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  12. 1332
    by JENG JR-YUAN, 鄭智元
    Published 2003
    ... the capital, but integrate the system, so the thesis will use LTCC to design wireless power transmission...
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  13. 1333
    by Hopkins, Andrew B. T.
    Published 2008
    ...Increased integration has resulted in the creation of so called System-onChip (SoC) devices...
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  14. 1334
    by Andrade, Diogo
    Published 2014
    ...”. _________________________________________________________________________________ ABSTRACT === In this work, a Translinear circuit synthesis algorithm, useful to convert a generic...
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  15. 1335
    by Guo,Jian-De, 郭鑑德
    Published 2016
    ... unit and a wireless transceiver unit, etc. It has QFN40 (6 mm * 6 mm * 1 mm) package conducive...
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  16. 1336
    ... (integrated circuit) industry has been the most complete, competitive and innovative industry in Taiwan over...
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  17. 1337
    by Wei-Chun Hua, 華偉君
    Published 2006
    .... The integrated power detector has a wide dynamic range of 20 dB. The dc current can be reduced to 53 mA...
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  18. 1338
    by Arabi, Eyad A.
    Published 2015
    .... The high level of 3D integration feasible in system on package design (SoP) concept can fulfill the latter...
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  19. 1339
    by Ming Han Liao, 廖洺漢
    Published 2007
    ...: It is a long sought goal to integrate ultralarge scale integrated (ULSI) circuits with the electro-optics...
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  20. 1340
    ... term electricity markets specific to the UK. The modelling comprises packages relating to the technical...
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