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1341“..., reusability, and QoS in the integration circuit environment of SoC, NoC architecture have developed its...”
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1342by Ahmad, Waqar“... gaining more attention for three-dimensional integrated circuits where on-chip inductance is much higher...”
Published 2012
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Doctoral Thesis -
1343by Moon, Jinyeong“... for simulation; designs of power electronics circuits for maximizing power harvest; and integration...”
Published 2016
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1344by Bemben, Richard Matthew“... computer aided design (CAD) software package for device layout, pMOS process integration on the toolset...”
Published 2014
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1345“... and technology in Taiwan is very successful, especially for integrated circuits (IC) industry. Its annual revenue...”
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1346by Mishra, Chinmaya“... of the synthesizers is integrated and tested as part of a 3-10 GHz packaged receiver. It draws 80 mA current from a...”
Published 2010
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1347“... kinds of coupled lines, good signal integrity (SI) at the receiving end is mainly attributed to high...”
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1348by Ping-Hung Hou, 侯秉宏“... discrete components on a printed circuit board (PCB), becoming a system-in-a-package (SiP) solution for LTE...”
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1349by Collado Miguens, Anna“... interconnection. This technique provides higher levels of integration for the packaging of sensors. In addition...”
Published 2003
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Doctoral Thesis -
1350“... the image using Visual Basic 2005. We use the FPGA circuit controller to integrate CMOS image sensor and AX...”
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1351“... and packaged in the compartment cases. This innovative design is to integrate the ignition circuit by directly...”
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1352by Zhang, Chaoming, 1980-“... and applications are emerging in the marketplace. In order to achieve higher levels of integration, RF circuits...”
Published 2013
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1353by Bahadori, Meisam“... applications. Four main categories for optical interfaces (Pluggable transceivers, On-board optics, Co-packaged...”
Published 2018
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1354
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1355“...-packages for implanted integrated circuits and to ensure their safe operation by monitoring the operating...”
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1356“... bonding, which is generally used in the package of IC (integrated circuit) chips. When the Au/Si bonding...”
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1357“... of adhesive strength,10 N/cm, between the adhesive tape and leadframe(metal) in integrated circuit(IC...”
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1358“... integrate-and-fire circuit acts as the post-neuron, and the FPGA is the controller to control the clock...”
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1359“... to integrate with active devices (such as diodes and transistors), they are popular in solid-state microwave...”
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1360by Mao, Yincan“... circuit or module layout, is unavoidable during production. Among all the parameters of MOSFET...”
Published 2018
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