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141by Seo, Chung-SeokSubjects: “...Application specific integrated circuits Design and construction...”
Published 2005
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144by Paula Veske, Pieter Bauwens, Frederick Bossuyt, Tom Sterken, Jan VanfleterenSubjects: “...packaging...”
Published 2020-12-01
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145“... of the simultaneous switching noise (SSN) problems in the power delivery networks (PDN) of high-speed digital circuit...”
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148“... reduce the packaging costs and make sure that the products conform to the specifications of the client...”
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149“... fabrication process. Optical interconnects is an important issue in silicon photonic integrated circuits...”
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150“.... This FOG photonic integrated circuit (PIC) is designed based on Smart Photonics InP/InGaAsP generic...”
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152by 陳君瑜“..., these additions increase packaging volume, integral complexity and cost. To address the above problems, a silicon...”
Published 2014
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154“.... Besides, the effects of EMI and package on device behavior are studied by using the SPICE software.It...”
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156“...碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 99 === Abstract High Voltage Integrated Circuit (HVIC...”
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157“..., the more the categories and capabilities of 3C electronic products have, the more complicate the circuit...”
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158by Holik, Sonia Maria“...The design and physical verification of contemporary integrated circuits is a challenging task due...”
Published 2010
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159by Ahmad, Tahir“... the Mathematica package. Experimental work was also carried out to investigate the characteristic of crosstalk...”
Published 1998
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160by Sutherland, David B.Subjects: “...Microwave circuits -- Design and construction...”
Published 2010
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