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161“... the laboratory. This thesis describes the development of solid-state spin-integrated circuits (S3IC) for quantum...”
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162by Deutsch, Sergej“... integrated circuits (3D ICs). A number of challenges associated with 3D test need to be addressed before 3D...”
Published 2015
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163
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164Published 2003Subjects: “...Integrated circuits--Very large scale integration--Design and construction...”
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165by Thompson, Dane C.Subjects: “...Radio frequency integrated circuits Design and construction...”
Published 2006
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166by Tao Zhang, Qijun Lu, Zhangming Zhu, Jincan Hu, Haiyang Xia, Lianming Li, Tie Jun CuiSubjects: “...integrated passive device...”
Published 2020-01-01
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167“... Circuits with Flip-Chip Package Technology and Distributed Amplifier Design School:National Central...”
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168“... in an integrated circuit fabrication plant wasexplored. First, the manufacturing process...”
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169Published 2013“... as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB...”
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170“..., with the trends of the slim, low-power, and high bandwidth features. The three-dimensional integration...”
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173by Lithotechsolutions.org“... including design, manufacturing, special equipment, materials, packaging and testing. The article series...”
Published 2018-08-01
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174“... vapor deposition (PE-CVD) low-k films is required for circuit speed and package. Low-k films deposited...”
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175“... between the stage of integrated circuit design and stage of production. In the industry, executives...”
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176
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177by Palojärvi, P. (Pasi)Subjects: “...integrated photodiode...”
Published 2003
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178by Yutzie, James D.Subjects: “...Printed circuits -- Design and construction...”
Published 2012
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179“... technology, the operation frequency and functions of Integrated Circuit is increasing so that cause...”
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180“... BiCMOS integrated circuits is presented in this paper. Suppose that EMI signals have been coupled into a...”
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