Showing 1 - 3 results of 3 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 0.59s Refine Results
  1. 1
    Coplanar waveguide structures on micromachined glass substrates
    by Bugyik, Paul L.
    Published 2007
    “...Micromachining is currently being studied to help reduce the packaging and integration costs...”
    Get full text
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  2. 2
    Coplanar waveguide structures on micromachined glass substrates
    by Bugyik, Paul L.
    Published 2007
    “...Micromachining is currently being studied to help reduce the packaging and integration costs...”
    Get full text
  3. 3
    Coplanar waveguide structures on micromachined glass substrates
    by Bugyik, Paul L.
    Published 2007
    “...Micromachining is currently being studied to help reduce the packaging and integration costs...”
    Get full text
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