Showing 1 - 3 results of 3 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 1.04s Refine Results
  1. 1
    A kinetic model of copper-to-copper direct bonding under thermal compression
    by Kai-Cheng Shie, A.M. Gusak, K.N. Tu, Chih Chen
    Published 2021-11-01
    Subjects: “...Three-dimensional integrated circuits...”
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    Article
  2. 2
    Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition
    by Tien-Lin Lu, Yu-An Shen, John A. Wu, Chih Chen
    Published 2019-12-01
    “... application in interconnects and three-dimensional integrated circuit (3D IC) packaging....”
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    Article
  3. 3
    A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps
    “...Abstract Microbumps in three-dimensional integrated circuit now becomes essential technology...”
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    Article
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