“...碩士 === 國立交通大學 === 電資學院學程碩士班 === 90 === Wire bond package is still the mainstream of IC packages...”
Get full text

“...). ESD is an inevitable event during fabrication, packaging and testing processes of integrated circuits...”
Get full text

“... drivers, LED lighting, solar energy and display driver circuits, high voltage integrated process...”
Get full text

“... prevention are two important reliability issues to the CMOS integrated circuits, especially in high-voltage...”
Get full text

“...). ESD is an inevitable event during fabrication, packaging and testing processes of integrated circuits...”
Get full text