“... dimensional integrated circuits (3D ICs). Compared to flip chip technology, the bump height of microbumps in 3...”
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“... and rather smaller size, three-dimensional integrated circuit (3D IC) packaging technology is regarded as a...”
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“... in recent years. In addition, the three-dimensional integrated circuit (3D IC) packaging technology has been...”
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“...-dimensional integrated circuit (3D IC), a larger temperature gradient is expected to be established when...”
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