Showing 1 - 4 results of 4 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 1.16s Refine Results
  1. 1
    Experimental and theoretical assessment of Through-Silicon Vias for 3D integrated microelectronic packages
    by Liu, Xi
    Published 2014
    Subjects: “...Three-dimensional integrated circuits...”
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  2. 2
    Electroplated multi-path compliant copper interconnects for flip-chip packages
    by Okereke, Raphael Ifeanyi
    Published 2014
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  3. 3
    Response of multi-path compliant interconnects subjected to drop and impact loading
    by Bhat, Anirudh
    Published 2014
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  4. 4
    Cohesive zone modeling for predicting interfacial delamination in microelectronic packaging
    by Krieger, William E. R.
    Published 2014
    Subjects: “...Microelectronic packaging...”
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