“... module. Because the integrated circuit (IC) is not regular design for implanted module application. IC...”
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“... module. Because the integrated circuit (IC) is not regular design for implanted module application. IC...”
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“... the technological positioning got from the Integrated Circuit (IC) packaging industry to present relatively...”
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“...碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 99 === The integrated-circuit (IC) semi-conductor industry is one...”
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“...碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 98 === 　　Wire bonding has been used in integrated circuit...”
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“...碩士 === 國立高雄第一科技大學 === 運籌管理系企業管理碩士班 === 103 === Integrated Circuit Assembly utilizes substrate as a...”
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“...碩士 === 逢甲大學 === 材料與製造工程所 === 100 === Due to requirement of circuit integration capacity...”
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“... and shorter. This means that the IC package is simultaneously evolving towards a higher level of circuit...”
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