Showing 1 - 20 results of 35 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 1.28s Refine Results
  1. 1
    Capable Copper Electrodeposition Process for Integrated Circuit - Substrate Packaging Manufacturing
    Published 2018
    Subjects: “...Packaging...”
    Get full text
    Doctoral Thesis
  2. 2
    System Interconnection Design Trade-offs in Three-Dimensional (3-D) Integrated Circuits
    by Weerasekera, Roshan
    Published 2008
    Subjects: “...Signal Integrity...”
    Get full text
    Get full text
    Doctoral Thesis
  3. 3
    Systems Integration for Biosensing: Design, Fabrication, and Packaging of Microelectronics, Sensors, and Microfluidics
    Published 2012
    Subjects: “...Packaging...”
    Get full text
    Doctoral Thesis
  4. 4
    Development of a Robust and Integrated Methodology for Predicting the Reliability of Microelectronic Packaging Systems
    Published 2013
    “... as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB...”
    Get full text
    Doctoral Thesis
  5. 5
    Integrated electronic and optoelectronic circuits and devices for pulsed time-of-flight laser rangefinding
    by Palojärvi, P. (Pasi)
    Published 2003
    Subjects: “...integrated photodiode...”
    Get full text
    Get full text
    Doctoral Thesis
  6. 6
    Integration and Fabrication Techniques for 3D Micro- and Nanodevices
    by Fischer, Andreas C.
    Published 2012
    Subjects: “...packaging...”
    Get full text
    Get full text
    Doctoral Thesis
  7. 7
    Contribució a l'estudi de l'acoblament per substrat en circuits integrats mixtes
    by Aragonès Cervera, Xavier
    Published 1997
    Subjects: “...integrated circuits...”
    Get full text
    Get full text
    Doctoral Thesis
  8. 8
    Bandwidth enhanced antennas for mobile terminals and multilayer ceramic packages
    by Komulainen, M. (Mikko)
    Published 2009
    Subjects: “...package integration...”
    Get full text
    Get full text
    Doctoral Thesis
  9. 9
    Wafer-level 3-D CMOS Integration of Very-large-scale Silicon Micromirror Arrays and Room-temperature Wafer-level Packaging
    by Lapisa, Martin
    Published 2013
    “... silicon, for MEMS devices that are closely integrated on top of sensitive integrated circuits substrates...”
    Get full text
    Get full text
    Doctoral Thesis
  10. 10
    Integrated Inductors with Micro-Patterned Magnetic Thin Films for RF and Power Applications
    Published 2013
    Subjects: “...In-package...”
    Get full text
    Doctoral Thesis
  11. 11
    Novel RF MEMS Switch and Packaging Concepts
    by Oberhammer, Joachim
    Published 2004
    Subjects: “...0-level packaging...”
    Get full text
    Get full text
    Doctoral Thesis
  12. 12
    System-on-package solutions for multi-band RF front end
    by Duo, Xinzhong
    Published 2005
    Subjects: “...chip-package co-design...”
    Get full text
    Get full text
    Doctoral Thesis
  13. 13
    Concurrent chip and package design for radio and mixed-signal systems
    by Shen, Meigen
    Published 2005
    “...The advances in VLSI and packaging technologies enable us to integrate a whole system on a single...”
    Get full text
    Get full text
    Doctoral Thesis
  14. 14
    Study of On-Chip Integrated Switched-Capacitor Voltage Regulator
    Published 2020
    “...abstract: Power management circuits have been more and more widely used in various applications...”
    Get full text
    Doctoral Thesis
  15. 15
    Heterogeneous Integration of Silicon and Printed Electronics for Intelligente Sensing Devices
    by Xie, Li
    Published 2014
    “...-based circuits, state-of-the-art all-printed circuits are encountering low integration density, long...”
    Get full text
    Get full text
    Doctoral Thesis
  16. 16
    Time-Domain/Digital Frequency Synchronized Hysteresis Based Fully Integrated Voltage Regulator
    Published 2019
    Subjects: “...Fully Integrated Voltage Regulator...”
    Get full text
    Doctoral Thesis
  17. 17
    Hybrid Integration of Active Bio-signal Cable with Intelligent Electrode : Steps toward Wearable Pervasive-Healthcare Applications
    by Geng, Yang
    Published 2012
    “... technologies nowadays, silicon based integrated circuits have shown great advantages in terms of tiny physical...”
    Get full text
    Get full text
    Doctoral Thesis
  18. 18
    Printed RFID Humidity Sensor Tags for Flexible Smart Systems
    by Feng, Yi
    Published 2015
    Subjects: “...Intelligent packaging...”
    Get full text
    Get full text
    Doctoral Thesis
  19. 19
    Ultra Wideband Impulse Radio for Wireless Sensing and Identification
    by Baghaei Nejad, Majid
    Published 2008
    Subjects: “...System-on-Package...”
    Get full text
    Get full text
    Doctoral Thesis
  20. 20
    Silicon X-ray smart sensor micromodule and microsystem
    by Wang, H. (Hongbo)
    Published 2002
    “..., design of the integrated circuit, design and packaging of the micromodules are presented in this thesis...”
    Get full text
    Get full text
    Doctoral Thesis
Search Tools: Get RSS Feed — Email this Search