Showing 1 - 20 results of 77 for search 'INTEGRATED CIRCUIT PACKAGING', query time: 3.90s Refine Results
  1. 1
    Electrical effects of CMOS circuit packaging
    by Zell, Christopher William
    Published 1996
    “..., and high I/O counts of CMOS integrated circuits make them particularly susceptible to excessive...”
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  2. 2
    Computer simulation of multiple coupled transmission lines in electronic packaging application.
    by Liao, Jen-Chyi.
    Published 1989
    Subjects: “...Integrated circuits -- Computer simulation....”
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  3. 3
    Multi-scale thermal and circuit analysis for nanometre-scale integrated circuits
    by Allec, NICHOLAS
    Published 2008
    Subjects: “...circuit analysis...”
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  4. 4
    Méthode de modélisation prédictive de boîtiers des circuits intégrés en vue d’anticiper avant design l’immunité au bruit du circuit
    by Bouchaala, Afef
    Published 2016
    Subjects: “...Virtual package prototyping...”
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  5. 5
    Integrated optoelectronics applications in fiber optic receiver packaging
    by Addington, J. Shawn
    Published 2014
    Subjects: “...packaging...”
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  6. 6
    Automated Wiring Analysis of Integrated Circuit Geometric Data
    by Lang, Charles Richard
    Published 1979
    “...<p>Methods are presented by which wiring data of an NMOS integrated circuit may be extracted from...”
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  7. 7
    Microfabrication and post-CMOS integration techniques for a reconfigurable wafer-sized circuit board
    by Radji, Moufid
    Published 2010
    “...). The user can simply deposit packaged integrated circuits on the smart active surface, and then a complex...”
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  8. 8
    S-parameter VLSI transmission line analysis.
    by Cooke, Bradly James.
    Published 1989
    Subjects: “...Integrated circuits -- Very large scale integration -- Design and construction...”
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  9. 9
    The American Institute for Manufacturing Integrated Photonics: advancing the ecosystem
    Subjects: “...photonic integrated circuits...”
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  10. 10
    Monolithic microwave integrated circuit (MMIC) low noise amplifier (LNA) design for radio astronomy applications
    by Seyfollahi, Alireza
    Published 2018
    Subjects: “...Monolithic Microwave Integrated Circuit...”
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  11. 11
    Conception en vue du Test des Circuits Intégrés 3D à base de TSVs
    by Fkih, Yassine
    Published 2014
    Subjects: “...Circuit intégré 3D...”
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  12. 12
    Macromodeling and simulation of linear components characterized by measured parameters
    by Zhang, Mingyang, 1981-
    Published 2008
    Subjects: “...Integrated circuits -- Very large scale integration -- Design and construction -- Mathematical...”
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  13. 13
    Integration of a 3.3 kW, AC/DC bidirectional converter using printed circuit board embedding technology
    by Caillaud, Rémy
    Published 2019
    Subjects: “...Circuit imprimé PCB...”
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  14. 14
    Guides d’onde Intégrés au Substrat (SIW) multicouches à haute performance pour des circuits millimétriques à faible coût
    by Parment, Frédéric
    Published 2016
    Subjects: “...Circuits passifs...”
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  15. 15
    Modèles compacts électro-thermiques du premier ordre et considération de bruit pour les circuits 3D
    by Ma, Yue
    Published 2018
    Subjects: “...Circuit intégré...”
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  16. 16
    Integrated Antennas and Active Beamformers Technology for mm-Wave Phased-Array Systems
    by Biglarbegian, Behzad
    Published 2012
    Subjects: “...integrated circuits...”
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  17. 17
    Integrated Antennas and Active Beamformers Technology for mm-Wave Phased-Array Systems
    by Biglarbegian, Behzad
    Published 2012
    Subjects: “...integrated circuits...”
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  18. 18
    Architecture of Silicon Photonic Links
    by Polster, Robert
    Published 2015
    Subjects: “...Circuits intégrés photoniques...”
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  19. 19
    Computational modelling studies of PtAs2, PtAsS and Pd2As mineral surfaces
    by Nemutudi, Bradley
    Published 2021
    Subjects: “...Analog integrated circuits...”
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  20. 20
    Novel die-to-die coaxial interconnect system for use in System-in-Package applications
    by McIntosh, Christopher Michael
    Published 2009
    “...The electrical parasitics of traditional integrated circuit (IC) packaging methods are a known...”
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