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  1. 1
    The Thermal Analysis of Integrated Circuit Package
    by Yi-Chen Yen, 嚴逸塵
    Published 2000
    “...碩士 === 國立成功大學 === 機械工程學系 === 88 === The packaging process is very important in the semiconductor...”
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  2. 2
    The Integrated Circuit Packaging Scheduling Problem
    by Chiao-Yi Chen, 陳巧頤
    Published 2000
    “...碩士 === 國立交通大學 === 工業工程與管理系 === 88 === The integrated circuit packaging scheduling problem (ICPSP...”
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  3. 3
    ELECTRICAL CHARACTERISTICS OF INTEGRATED CIRCUIT PACKAGES
    by Senthinathan, Ramesh, 1961-
    Published 1987
    Subjects: “...Integrated circuits....”
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  4. 4
    Inspection of Packaged Integrated Circuits using Terahertz Radiation
    by Andreas Fritz, Thomas Arnold
    Published 2014-12-01
    Subjects: “...terahertz; Time domain spectroscopy; Wavelet transformation; Wavelet denosing; packaged integrated...”
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    Article
  5. 5
    Design and research of the bandwidth enhanced circuits for wire bonding in integrated circuit packaging
    by Huang Sheng Kai, 黃聖凱
    Published 2011
    “... systems and tend to make high-frequency circuit applications, as well as integrated circuit packaging...”
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  6. 6
    Multiscale EM and circuit simulation using the Laguerre-FDTD scheme for package-aware integrated-circuit design
    by Srinivasan, Gopikrishna
    Published 2008
    Subjects: “...Integrated circuits Design and construction...”
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  7. 7
    Design and implementation of an integrated VLSI packaging support software environment
    by Whipple, Thomas Driggs, 1961-
    Published 1989
    Subjects: “...Integrated circuits -- Simulation methods....”
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  8. 8
    Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
    Subjects: “...photonic integrated circuits (PICs)...”
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    Article
  9. 9
    Process Evaluation and Improvement Model of Semiconductor Integrated Circuit Packaging
    by Shih-chang Huang, 黃世章
    Published 2018
    “... integrated with the features of large capacity, high bandwidth, low power consumption, and miniaturization...”
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  10. 10
    Multiwire microstrip interconnects for high-frequency integrated circuit packaging
    by Cafaro, Nicholas Giovanni, Jr.
    Published 2007
    Subjects: “...Wire bonding (Electronic packaging)...”
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  11. 11
    Dual gate microwave devices and technologies of integrated circuits packaging
    by Ping-Lin Chen, 陳柄霖
    Published 2000
    “...,we probe into the popular package technology──Ball Grid Array . And we also probe into how the BGA...”
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  12. 12
    Electrical Modeling of Integrated-Circuit Packages Using Electromagnetic Methods
    by 何承諭
    Published 2004
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  13. 13
    Wettability of low Sn solders on integrated circuit package metallizations
    by Gabriel, Michelle Wendy
    Published 2008
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  14. 14
    Modeling and Minimization of Integrated Circuit Packaging Parasitics at Radio Frequencies
    by Benedik, Christopher
    Published 2013
    Subjects: “...integrated circuit packaging...”
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  15. 15
    The effect of die attach voiding on the thermal resistance of integrated circuit package
    by Chang, Li-hsin, 1946-
    Published 1987
    Subjects: “...Integrated circuits -- Design....”
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  16. 16
    Materials research on metallized aluminum-nitride for microelectronic packaging
    by Newberg, Carl Edward, 1962-
    Published 1988
    Subjects: “...Integrated circuits -- Materials -- Electric properties....”
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  17. 17
    Model extraction of a paddle in plastic surface-mount RF-IC packages
    by Sundberg, Garth
    Published 2012
    Subjects: “...Integrated circuits -- Packaging...”
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  18. 18
    Analysis domain truncation of interconnections in multilayer packaging structures
    by Garg, Nitin Kumar, 1967-
    Published 1989
    Subjects: “...Integrated circuits....”
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  19. 19
    Phase Change Materials for Thermal Management of IC Packages
    by P. Fiala, I. Behunek
    Published 2007-06-01
    Subjects: “...integrated circuit...”
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    Article
  20. 20
    Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages
    by Konstantin O. Petrosyants, Nikita I. Ryabov
    Published 2020-06-01
    Subjects: “...LSI packages...”
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    Article
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