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  1. 41
    Compliant Wafer Level Package (CWLP)
    by Patel, Chirag Suryakant
    Published 2007
    Subjects: “...Integrated circuits Wafer-scale integration...”
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  2. 42
    Efficient Approach for Electrical Design and Analysis of High-Speed Interconnect in Integrated Circuit Packages
    by Myunghoi Kim, Sunkyu Kong
    Published 2020-02-01
    Subjects: “...ic package...”
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    Article
  3. 43
    Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process
    by Chun-Ming Yang, Kuo-Ping Lin, Kuen-Suan Chen
    Published 2019-06-01
    Subjects: “...integrated-circuit packaging...”
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    Article
  4. 44
    Study of thermomigration on lead-free micro bump in three-dimensional integrated circuits packaging
    by Jhu, Wei-Cheng, 朱偉誠
    Published 2013
    “... dimensional integrated circuits (3D ICs). Compared to flip chip technology, the bump height of microbumps in 3...”
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  5. 45
    Design of Microwave and Millimeter Wave Integrated Circuit Packages Using 3D Technology
    by Yu-Chih Lin, 林宇志
    Published 2012
    “... operations. We realized on printed circuit board a grounded coplanar waveguide (CPWG) and on gallium arsenic...”
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  6. 46
    Power Integrity Analysis for High-Speed Circuit Package Using Transmission Line Method
    by Ming-Fong Jhong, 鍾明峰
    Published 2006
    “... a critical factor to degrade the signal integrity (SI) and power integrity (PI) in PCB or package...”
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  7. 47
    Evaluating performance of Integrated Circuit Packaging and Testing Firms -Application DEA and Bootstrap DEA
    by Yu, Kuei-Ching, 游桂靜
    Published 2013
    “...碩士 === 明道大學 === 產業創新與經營學系碩士班 === 101 === Taiwan’s Integrated Circuit Packaging and Testing (ICPT...”
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  8. 48
    Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package
    Subjects: “...wafer level LED package....”
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    Article
  9. 49
    Considerations in the simulation of large monolithic microwave integrated circuits enclosed in a conducting package
    by Burke, John Joseph
    Published 1993
    “...This thesis presents a numerical and experimental analysis of MMIC circuits enclosed in a...”
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  10. 50
    Structural thermal-electric modeling and analysis of micro-springs for microelectronic probing and packaging applications
    by Ahmad, Mudasir
    Published 2008
    Subjects: “...Integrated circuits Testing...”
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  11. 51
    Study on no-flow underfill materials for low-cost flip-chip applications
    by Shi, Songhua
    Published 2008
    Subjects: “...Integrated circuits...”
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  12. 52
    THERMAL MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGING
    by Jafar, Mutaz, 1960-
    Published 1986
    Subjects: “...Integrated circuits -- Very large scale integration....”
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  13. 53
    WR-3.4 Overmoded Waveguide Module for the Packaging of a Linear Integrated-Circuit Array
    by Jeon, S., Kim, M., Kim, Y., Lee, J.
    Published 2022
    Subjects: “...integrated waveguide transition...”
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    Article
  14. 54
    Radio frequency circuit design and packaging for silicon-germanium hetrojunction bipolar technology.
    by Poh, Chung Hang
    Published 2010
    Subjects: “...Radio frequency integrated circuits...”
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  15. 55
    Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill
    by Park, Ji Eun
    Published 2007
    Subjects: “...Integrated circuits Fault tolerance...”
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  16. 56
    Optimization of Water Recycling Strategy for an Integrated-Circuit Packaging Fab:A Scenario-Base Analysis
    by Lu, Bo-hsun, 呂柏勳
    Published 2018
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  17. 57
    Electromigration-induced failure on lead-free micro bumps in three-dimensional integrated circuits packaging
    by Hao, Hsu, 徐皓
    Published 2012
    “... and rather smaller size, three-dimensional integrated circuit (3D IC) packaging technology is regarded as a...”
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  18. 58
    Thermal management of three-dimensional integrated circuits using inter-layer liquid cooling
    by King, Calvin R., Jr.
    Published 2012
    Subjects: “...Packaging...”
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  19. 59
    Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits
    Subjects: “...integrated photonics...”
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    Article
  20. 60
    Ejectorless Method for Die Attach Pick Up for Cracking Improvement on Thin High-Aspect Ratio Die
    Subjects: “...die attach, miniaturization, integrated circuit, packaging process...”
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    Article
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