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  1. 81
    Modeling, design, fabrication and characterization of glass package-to-PCB interconnections
    by Menezes, Gary
    Published 2014
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  2. 82
    Predictive statistical analysis of embedded meander resistors via measurement of canonical building blocks
    by Carastro, Lawrence A.
    Published 2007
    Subjects: “...Integrated circuits Passivation...”
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  3. 83
    Extreme environment interconnects and packaging for power electronics
    Subjects: “...integrated circuit packaging...”
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    Article
  4. 84
    800 MB/s DDR NAND Flash Memory Multi-Chip Package With Source-Synchronous Interface for Point-to-Point Ring Topology
    Subjects: “...high speed integrated circuits...”
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    Article
  5. 85
    Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics
    by Sundaram, Venkatesh
    Published 2009
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  6. 86
    System Interconnection Design Trade-offs in Three-Dimensional (3-D) Integrated Circuits
    by Weerasekera, Roshan
    Published 2008
    Subjects: “...Signal Integrity...”
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    Doctoral Thesis
  7. 87
    Transformer and System in Package for RF and Millimeter-wave Circuit Applications
    by Che-Chung Kuo, 郭哲均
    Published 2012
    “..., the miniature chip area of integrated circuit chip becomes more valuable, and the circuit designers always try...”
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  8. 88
    APTMC: AN INTERFACE PROGRAM FOR USE WITH ANSYS FOR THERMAL AND THERMALLY INDUCED STRESS MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGING
    by Shiang, Jyue-Jon, 1956-
    Published 1987
    Subjects: “...Integrated circuits -- Very large scale integration -- Packaging....”
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  9. 89
    Research on intergenerational and development of hybrid integration technology
    by Zhu Yusheng, Shi Jing, Chen Cheng
    Published 2021-04-01
    Subjects: “...hybrid integrated circuit...”
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    Article
  10. 90
    Electromagnetic compatibility modeling for integrated circuits
    by Huang, Kuan Hsiang, Nick, 黃冠翔
    Published 2014
    Subjects: “...Integrated circuits...”
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  11. 91
    Experimental and theoretical assessment of Through-Silicon Vias for 3D integrated microelectronic packages
    by Liu, Xi
    Published 2014
    Subjects: “...Three-dimensional integrated circuits...”
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  12. 92
    Data base optimisation for an I.C. design layout package on the VAX.
    by Figg, P. G.
    Published 2012
    Subjects: “...Integrated circuits--Design and construction....”
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  13. 93
    Mise en boitier de circuits intégrés micro-ondes en technologie LTCC
    by RIDA, Khodor Hussein
    Published 2013
    Subjects: “...RF packaging...”
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  14. 94
    The System-level Package Effect Research and Modeling by Packaging Integrated Passive Device
    by Po-Hui Yu, 余柏輝
    Published 2012
    “..., and propose the complete package equivalent circuit model. ...”
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  15. 95
    Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
    Subjects: “...fan-out wafer level packaging...”
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    Article
  16. 96
    Fast Algorithms for High Frequency Interconnect Modeling in VLSI Circuits and Packages
    by Yi, Yang
    Published 2011
    “... for high frequency circuits and packages. 1) Multiple dielectrics are common in integrated circuits...”
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  17. 97
    Design issues for interconnection networks in massively parallel processing systems under advanced VLSI and packaging constraints
    by Lacy, William Stephen
    Published 2007
    Subjects: “...Integrated circuits Very large scale integration...”
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  18. 98
    Multi-scale thermal and circuit analysis for nanometre-scale integrated circuits
    by Allec, NICHOLAS
    Published 2008
    Subjects: “...circuit analysis...”
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    Others
  19. 99
    Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approach
    by Mehrotra, Gaurav
    Published 2008
    Subjects: “...Interconnects (Integrated circuit technology)...”
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  20. 100
    3D MICROPACKAGING OF INTEGRATED CIRCUITS
    by Băjenescu, Titu-Marius I.
    Published 2020-03-01
    “... some actual problems and reliability challenges in 3D IC packaging technology. It shows how different...”
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    Article
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