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1Published 2002“... and Particle Damping Technology --- p.2 === Chapter 1.2 --- Literature Review --- p.4 === Chapter 1.3...”
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2Published 2016“... precision over a large area (> 6”) for a variety of material options and multi-layer printing capability...”
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3Published 2003“... --- p.1 === Chapter 1.1 --- Printed circuit board manufacturing industry in Hong Kong --- p.1...”
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4Published 2012“..., B-3 & B-4) isolated from a commercial sufu manufacturing process and four commercial strains (B...”
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5Compliant mechanisms with distributed compliance and characteristic stiffness: a level set approach.Published 2007“... by the challenge of how to get more manufacturable compliant mechanism designs for MEMS devices. Considering MEMS...”
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