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1“... weight and high density of electronic products， the traditional single chip package has no longer met...”
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2“... of the electronic products progress, the requirements for frivolous short, high frequency, high speed and the high...”
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3“... performance, low cost and multi-functions in electronics industries, the Package-on-package (PoP) stacking...”
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4“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 101 === In recent years, the electronic products have been well...”
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5“..., this paper aims to improve the fatigue life of the package and ensure the stability of product quality. First...”
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6“... products market and the consumer's preference for products with smaller size, the structure of 3D stacked...”
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7“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 95 === Since the quad flat no-lead package (QFN) is closed to Chip...”
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8“... products with smaller size, lower cost, larger storage space and integration of function.The RCP...”
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9“... of semiconductors for the electronic products, the electronic packaging has been focused on the technology of multi...”
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10“... products and the interconnection between the electronic components and printing circuit board due...”
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11“... and high speed, the application of the Direct Chip Attach technique on the packages has gradually increased...”
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12“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 93 === The Wafer Level Chip Scale Package (WLCSP) is a packaging...”
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13“... product, such as IC design, manufacture, package assembly, test etc. The materials applied...”
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14“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 96 === In recent years, the consuming electronic products have been...”
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15“...碩士 === 國立成功大學 === 工程科學系碩博士班 === 93 === The Wafer Level Chip Scale Package (WLCSP) has increasingly...”
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