Showing 1 - 20 results of 28 for search 'SEMICONDUCTOR DEVICES', query time: 0.74s Refine Results
  1. 1
    by Jen-Chou Tseng, 曾仁洲
    Published 2007
    ...-semiconductor (MOS) devices. With respect to the formation of stress-induced traps in gate oxide, dc stress...
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  2. 2
    by Chien-Chih Lin, 林建智
    Published 2014
    ...博士 === 國立臺灣大學 === 電子工程學研究所 === 102 === With the aggressive downscaling of MOS devices...
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  3. 3
    by Ming-Han Yang, 楊明翰
    Published 2017
    ...碩士 === 國立臺灣大學 === 電子工程學研究所 === 105 === Metal-insulator-semiconductor (MIS) tunneling diode is a...
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  4. 4
    by Chia-Te Lin, 林家德
    Published 2018
    ... characteristics of our targeting devices have definitely gotten enhanced through some simple adjustment...
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  5. 5
    by Tsung-Miau Wang, 王宗苗
    Published 2007
    ... in the interface and the charges have different phases. As the device size increasing, the negative capacitance...
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  6. 6
    by Chang-Tai Yang, 楊彰臺
    Published 2016
    ... and Metal-Insulator-Semiconductor models. In chapter 3, by using the effect of lateral diffusion current...
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  7. 7
    by Chang-Feng Yang, Jenn-Gwo Hwu
    Published 2016-12-01
    ...Due to the simplicity of the fabrication process, the ultra-thin oxide metal-oxide-semiconductor...
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  8. 8
    by Chien-Shun Liao, 廖建舜
    Published 2017
    ... of the laterally gated metal-insulator-semiconductor (MIS) tunnel diode with Al/SiO2/Si(p) structure had been...
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  9. 9
    by Yu-Hsuan Chen, 陳昱諠
    Published 2019
    ...-voltage characteristics of a double metal-insulator-semiconductor (MIS(p)) tunnel diode (TD) in a...
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  10. 10
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  12. 12
    by Chieh-Fang Cheng, 鄭捷方
    Published 2019
    ...-Semiconductor (RG MIS) tunnel diodes with various oxide thickness were demonstrated that the UTMSG MIS devices...
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  13. 13
    by Man-Wen Cheng, 鄭曼雯
    Published 2005
    ... and reliability of semiconductor devices. Especially, the quality of the gate dielectric layer is extremely...
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  14. 14
    by Chao-Shun Yang, 楊朝舜
    Published 2012
    ... of semiconductor and the existence of the Moore, law, the size of device is scaling down continuously. However...
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  15. 15
    by Rong-Yu Zheng, 鄭容裕
    Published 2003
    ... in the fabrication of advanced semiconductor devices. However, the most common criticisms of RTP are about...
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  16. 16
    by Jui-Feng Hsu, 徐瑞豐
    Published 2002
    ... of metal-Al2O3-SiO2-semiconductor capacitors is introduced. Measurement of equivalent oxide thickness...
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  17. 17
    by Jun-Yao Chen, 陳俊堯
    Published 2016
    ... embedded aluminum in metal-insulator-semiconductor (MIS) tunnel diodes on the reduction of lateral non...
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  18. 18
    by Yu-Jen Lee, 李祐任
    Published 2010
    ...碩士 === 國立臺灣大學 === 電子工程學研究所 === 98 === Because of the progress of the technology of semiconductor...
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  19. 19
    by Hsing-Lin Chen, 陳星霖
    Published 2008
    ... of semiconductor, there are great results in the scaling of MOS devices. Based on the International Technology...
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  20. 20
    by Yuh-Ren Yen, 顏育仁
    Published 2000
    ... technology in the fabrication of advanced semiconductor devices. However, the most common criticisms of RTP...
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