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Engineering: general
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1241by McCloskey, Edward Daniel“... negative resistance circuits. Three passive resonators were designed, fabricated, and measured to determine...”
Published 2014
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1242“... fabricated and optimized, and then join together in the back end process. In this approach, flip-chip...”
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1243by Wang, Lu“... and fabricated using the IBM BiCMOS 8HP 0.13 µm technology. The MINS IC has 256 input channels that are time...”
Published 2015
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1244by Sangkil Kim, Amin Rida, Vasileios Lakafosis, Symeon Nikolaou, Manos M. Tentzeris“... of ICs in 3D multi‐chip modules. An antenna array is designed and implemented using multilayer coupled...”
Published 2019-01-01
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1245by Honrao, Chinmay“...Multi-chip integration with emerging technologies such as a 3D IC stack or 2.5D interposer...”
Published 2014
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1246“... crystallization, and combine with an offset top gate mask design to fabricate asymmetric TFT-SONOS devices...”
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1247by Viale, Benjamin“... fabrication est devenu un enjeu majeur dans l’industrie des semi-conducteurs. Des outils commerciaux...”
Published 2017
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1248by Amran Hossain, Mohammad Tariqul Islam, Muhammad E. H. Chowdhury, Md. Samsuzzaman“...%), which are significant factors for microwave head imaging. Various design structures are performed...”
Published 2020-01-01
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1249by Ng, Benny“...This thesis designed and fabricated an active contact lens that notifies the user during...”
Published 2015
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1250by Raghavan, Sathyanarayanan“... on a single integrated circuit (IC), on-chip interconnection has become a challenge in terms...”
Published 2016
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1251“...-shaking readout. A prototype chip with a 64 × 64 CIS array is designed and fabricated in TSMC 0.18-μm CIS...”
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1252“... is the superior solution for the IC design, i.e. the designers can therefore obtain the lower power dissipation...”
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1253by Sobering, Ian David“... containing a pair of QPSK transmitters with integrated 100mW Class-C PAs was designed and fabricated...”
Published 2015
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1254“...It has been designed and fabricated robot obstacle avoidance using ultrasonic Sensors based...”
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1255by Lawrence, M.A.“... not (the Connection Admission Control and Switch Management systems as well as the Cell Switch Fabric...”
Published 2014
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1256“... and their reliabilities during product designs, fabrications and services. The purpose of this study is to investigate...”
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1257by Bhana, Vishal Bhooshan“..., from the integrated circuit (IC) design tool, into the full-wave EM simulator to evaluate and verify...”
Published 2018
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1258“... interconnect. There are many schemes to fabricate dual damascene structure. The most common integration...”
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1259by 莊祖維“... to solve the problem and integrated the low noise amplifier with it. This IC was fabricated with TSMC 0.25μ...”
Published 2014
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1260“... novel ESD protection circuits. Thesecircuits were designed by computer-aided IC layout software...”
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