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1341by Souza, Jeckson Dellagostin“... on the fabric at run-time. Using representative benchmarks, we show that one version of the heterogeneous system...”
Published 2016
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1342by Souza, Jeckson Dellagostin“... on the fabric at run-time. Using representative benchmarks, we show that one version of the heterogeneous system...”
Published 2016
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1343by Souza, Jeckson Dellagostin“... on the fabric at run-time. Using representative benchmarks, we show that one version of the heterogeneous system...”
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1344by Wiedenmann, Jonas“...). In this regard, experiments have been designed to investigate the theoretical ideas first pioneered by Fu...”
Published 2018
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Doctoral Thesis -
1345by Nedel, Werner Mauricio“... alto poder computacional. A arquitetura FlexGrip (FLEXible GRaphIcs Processor) é um exemplo de GPGPU...”
Published 2016
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1346by Nedel, Werner Mauricio“... alto poder computacional. A arquitetura FlexGrip (FLEXible GRaphIcs Processor) é um exemplo de GPGPU...”
Published 2016
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1347by Nedel, Werner Mauricio“... alto poder computacional. A arquitetura FlexGrip (FLEXible GRaphIcs Processor) é um exemplo de GPGPU...”
Published 2016
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1348“... (CDM) pulse, is a serious problem to integrated circuits (ICs). A combined TCAD simulation and very...”
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1349
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1350by Honarvar Nazari, Meisam“... of integrated circuits (ICs). This constant growth drives an increasing demand for high-bandwidth communication...”
Published 2013
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1351“... to amplify it for next processing (such as A/D converter). Currently, many op amp ICs could...”
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1352Published 2011“.... This approach utilizes simulation to support the design of integrated circuits (ICs) to meet targeted tolerance...”
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Doctoral Thesis -
1353“... system on chip). The prototype acquisition module consists of commercial ICs and self-designed chips: A...”
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1354“...In this paper, a design approach for aperture coupled modified cylindrical dielectric resonator...”
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1355“...mw low power dissipation. The three ICs in this thesis are all designed and fabricated using CMOS...”
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1356
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1357by Werquin, Arnaud“... is performed with o_-board components. The fabricated prototype digital envelope modulator IC demonstrates...”
Published 2013
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1358“.... It implies that a 3D-ICs packaging technology at least has a stacking framework with two chips. Due...”
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1359by Nicolas Lebouvier, Fabrice Pagniez, Young Min Na, Da Shi, Patricia Pinson, Mathieu Marchivie, Jean Guillon, Tarek Hakki, Rita Bernhardt, Sook Wah Yee, Claire Simons, Marie-Pierre Lézé, Rolf W. Hartmann, Angélique Mularoni, Guillaume Le Baut, Isabelle Krimm, Ruben Abagyan, Patrice Le Pape, Marc Le Borgne“...A series of 2-aryl-3-azolyl-1-indolyl-propan-2-ols was designed as new analogs of fluconazole (FLC...”
Published 2020-08-01
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1360“... design parameters. A test chip of the proposed converter was successfully fabricated in a 0.8...”
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