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林宗寬
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林宗寬
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林宗寬
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1
Study on the mechanical property of modified bismaleimides for Kevlar fiber composite.
by
T. K. Lin
,
林宗
寬
Published 2000
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2
Investigation of Electrical Properties and Reliabilities of Chip-on-Glass(COG)with Compliant Bumps
by
Chung Kuang Lin
,
林宗
寬
Published 2007
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3
化學處理對克維拉纖維複合材料介面及破壞性質之研究
by
LIN, ZONG-KUAN
,
林宗
寬
Published 1993
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4
Electromigration in flip-chip solder joints: Effect of temperature on failure mechanism and analysis of bump resistance curves
by
Lin, Chung-Kuang
,
林宗
寬
Published 2014
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