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游家源
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游家源
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1
Application of Project Management on Semiconductor Advanced Process Qualification-The Case of 28nm wafer Technology of CuPd Wirebonding IC Assembly Package
by
Yu, Chia-Yuan
,
游
家
源
Published 2017
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2
Biomechanical Analyses of Gait in Balance Response to Slip
by
Jia-Yuan You
,
游
家
源
Published 2001
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3
Electronic and structural properties of Cu2Se related materials studied by X-ray absorption spectroscopy
by
Jia-Yuan You
,
游
家
源
Published 2015
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