Showing 1 - 15 results of 15 for search '蔡明義', query time: 0.08s Refine Results
  1. 1
    A Study on Active Status about Implementing International Social Responsibility Norms (SA8000) of the Shoemakers of Taiwan
    by Ming-Yi Tsai, 蔡明義
    Published 2003
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  2. 2
    The cyclization reaction of sulfonamides with sulfonyl radicals
    by Ming-YiTsai, 蔡明義
    Published 2012
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  3. 3
    CMP Diamond Conditioner Dressing Characteristics of Polyurethane Pad
    by Ming-Yi Tsai, 蔡明義
    Published 2007
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  4. 4
    study and experimental investigation of mechanical wear mechanisms for the chemical planarization of silicon wafer
    by Ming-Yi Tsai, 蔡明義
    Published 1999
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  5. 5
    The Electronic Structure and Defects Studies of Synthetic FeS2
    by Tsay Ming Yih, 蔡明義
    Published 1995
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  6. 6
    A Study on Active Status about Implementing International Social Responsibility Norms (SA8000) of the Shoemakers of Taiwan
    by Ming-Yi Tsai, 蔡明義
    Published 2003
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  7. 7
    None
    by Ming-Yi Tsai, 蔡明義
    Published 2002
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  8. 8
    A study of Hydrophilic CMP Graphite Impregnated Pad and it’s Characteristics of Conditioning and Polishing Wafer for Oxide Film
    by Li-Wei Yan, 顏力偉
    Published 2010
    Other Authors: “...蔡明義...”
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  9. 9
    Optimal Gold-Ball Bonding Parameters Determined from Ball Shear and Wire Pull Tests.
    by Rong-Guey Liu, 劉榮貴
    Published 2011
    Other Authors: “...蔡明義...”
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  10. 10
    Thermal Deformation Measurements of Electronic Packaging Structures Using Laser Interferometric Systems
    by 蔣文琪
    Published 2000
    Other Authors: “...蔡明義...”
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  11. 11
    Numerical and Theoretical Analyses of Die Attach Assembly
    by T. M. Liu, 劉子民
    Published 2002
    Other Authors: “...蔡明義...”
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  12. 12
    Thermal conductivity measurements and heat transfer analysis of electronic package
    by 黃皓威
    Published 2004
    Other Authors: “...蔡明義...”
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  13. 13
    Determination of Silicon Die Strength
    by 林正雄
    Published 2004
    Other Authors: “...蔡明義...”
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  14. 14
    Thermal Cycling Life of QFN Package Assembly
    by 韓政男
    Published 2003
    Other Authors: “...蔡明義...”
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  15. 15
    Thermal Induced Deformations and Stresses of Stacked Die Packages
    by 黃紹庚
    Published 2004
    Other Authors: “...蔡明義...”
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