Special Issue on “Micro/Nano Manufacturing”

by André Zimmermann, Stefan Dimov
Published 2019-06-01

Review on Fabrication Technologies for Optical Mold Inserts

by Marcel Roeder, Thomas Guenther, André Zimmermann
Published 2019-04-01

Towards a Tailored Engineering Design Process for Individualized Micro-Mechatronic Systems with a Novel Case-Based Methodology

by Faruk Civelek, Karl-Peter Fritz, André Zimmermann
Published 2021-08-01

Bending Setups for Reliability Investigation of Flexible Electronics

by Rafat Saleh, Maximilian Barth, Wolfgang Eberhardt, André Zimmermann
Published 2021-01-01

CMOS-Compatible Measures for Thermal Management of Phase-Sensitive Silicon Photonic Systems

by Pedro-Andrei Krochin-Yepez, Ulrike Scholz, Andre Zimmermann
Published 2020-01-01

Temperature Dependence of the Steering Angles of a Silicon Photonic Optical Phased Array

by Pedro Andrei Krochin Yepez, Ulrike Scholz, Andre Zimmermann
Published 2020-01-01

Conceptual Planning of Micro-Assembly for a Better Utilization of Reconfigurable Manufacturing Systems

by Christoph Gielisch, Karl-Peter Fritz, Benedikt Wigger, André Zimmermann
Published 2020-04-01

A Product Development Approach in The Field of Micro-Assembly with Emphasis on Conceptual Design

by Christoph Gielisch, Karl-Peter Fritz, Anika Noack, André Zimmermann
Published 2019-05-01

Feasibility Study of Soft Tooling Inserts for Injection Molding with Integrated Automated Slides

by Tobias Vieten, Dennis Stahl, Peter Schilling, Faruk Civelek, André Zimmermann
Published 2021-06-01

A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation

by Mahdi Soltani, Romit Kulkarni, Tobias Scheinost, Tobias Groezinger, Andre Zimmermann
Published 2019-01-01

Development and Proof of Concept of a Miniaturized MEMS Quantum Tunneling Accelerometer Based on PtC Tips by Focused Ion Beam 3D Nano-Patterning

by Michael Haub, Martin Bogner, Thomas Guenther, André Zimmermann, Hermann Sandmaier
Published 2021-05-01

Novel Measures for Thermal Management of Silicon Photonic Optical Phased Arrays

by Pedro Andrei Krochin Yepez, Ulrike Scholz, Jan Niklas Caspers, Andre Zimmermann
Published 2019-01-01

Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors

by Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel, Christine Harendt, André Zimmermann
Published 2017-06-01

Development and Validation of a Novel Setup for LEDs Lifetime Estimation on Molded Interconnect Devices

by Mahdi Soltani, Moritz Freyburger, Romit Kulkarni, Rainer Mohr, Tobias Groezinger, André Zimmermann
Published 2018-12-01

Injection Compression Molded Microlens Arrays for Hyperspectral Imaging

by Marcel Roeder, Marc Drexler, Thilo Rothermel, Thomas Meissner, Thomas Guenther, André Zimmermann
Published 2018-07-01

Soft Tooling-Friendly Inductive Mold Heating—A Novel Concept

by Tobias Vieten, Davide Zanin, Andrea Knöller, Thomas Litwin, Wolfgang Eberhardt, André Zimmermann
Published 2021-04-01

Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB

by Mahdi Soltani, Moritz Freyburger, Romit Kulkarni, Rainer Mohr, Tobias Groezinger, Andre Zimmermann
Published 2018-01-01

Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist

by Florian Janek, Nadine Eichhorn, Sascha Weser, Kerstin Gläser, Wolfgang Eberhardt, André Zimmermann
Published 2021-07-01

An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages

by Romit Kulkarni, Peter Wappler, Mahdi Soltani, Mehmet Haybat, Thomas Guenther, Tobias Groezinger, André Zimmermann
Published 2019-02-01

Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane

by Adrian Schwenck, Tobias Grözinger, Thomas Günther, Axel Schumacher, Dietmar Schuhmacher, Kai Werum, André Zimmermann
Published 2021-08-01