New Ruthenium-Catalyzed Cleavage of a Carbon -Carbon Triple Bond and Rearrangement of α,β-Epoxy Ketones into 1,2-Diketones

by Chia-Lung Chang, 張嘉隆
Published 2003

Fabrication and Characterization of Tungsten Oxide and Nickel Nanowires self-synthesized with Anodic Aluminum Oxide Template

by Chia-Lung Chang, 張家隆
Published 2007

Effluence of Varying Interpretation Styles on Environmental Education : A Case Study of Kinmen National Park

by Chia-lung Chang, 張嘉蓉
Published 2013

Magnesium Oxide (MgO) pH-sensitive Sensing Membrane in Electrolyte-Insulator-Semiconductor Structures with CF4 Plasma Treatment

by Chyuan-Haur Kao, Chia Lung Chang, Wei Ming Su, Yu Tzu Chen, Chien Cheng Lu, Yu Shan Lee, Chen Hao Hong, Chan-Yu Lin, Hsiang Chen
Published 2017-08-01

The Effects of Bolt Tightening Sequences on The Mechanical Behaviors of Gasketed Flange Joint

by Huang, Jyun-Siang, 黃俊翔
Published 2014

A Simulation Study of the Effect of Material Properties of Molding Compound and Die Attach as well Die Attach Thickness on Thin Type Package

by Pei-Yin Chen, 陳佩吟
Published 2008

Thermal and Warpage Analysis of IC Packages

by Chih-Wei Cheng, 鄭世偉
Published 1999

Application of Reverse Simulation in Design of Forging Workpiece

by Yu-Jhen Li, 李育臻
Published 2008

The Study of Photoelastic and Hole-DrillingMethod in Measurement of Mechanical Characteristics of the Weldment

by Roy Yu, 游偉雄
Published 2001

Mold Flow and Thermal Analysis of Ball Grid Array Packages

by Yung-hsing Hsu, 徐永興
Published 2005

Warpage and Stress Analysis of Three Dimensional Lead-Frame Type Packages

by Cheng-Jie Li, 李成傑
Published 2005

Applications of CFD and Mold Flow in the Design and Analysis of Thin Type IC Packages

by Si-Min Lo, 羅世閔
Published 2001

Thermal/ Mechanical Design and Analysis of Thin Type IC Packages

by Chih Chiang Wang, 王志強
Published 2001

The Thermal and Mold Flow Analysis of Chip Scale Packages

by Kai - Chieh, 曹凱傑
Published 2004

Warpage and Stress Analysis of μBGA

by Chia-Hao Tseng, 曾家豪
Published 2004

Design and Fabrication of An Electro-Thermal Microactuator with Multi-Lateral Motion in Plane

by Yi-Kun Chen, 陳義坤
Published 2004

Inverse method based on vibration test and optimization method for characterizing the elastic properties

by Yu-Hua Lin, 林玉華
Published 2010

Optimal Parameter Design and Residual Stress simulation for Forming Production

by Jia-Cheng Lin, 林家成
Published 2010

A Simulation of temperature distribution and thermaldeformation of ball screw

by Chin-Chia Yang, 楊晉嘉
Published 2010

Effects of Thermal and Moisture Loadings on Interfacial Stresses of Electronic Package

by Po-Hsien Li, 李柏憲
Published 2010