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Do-Seok Kim
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Do-Seok Kim
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Do-Seok Kim
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1
Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
by
Min-Soo Kang
,
Do
-
Seok
Kim
,
Young-Eui Shin
Published 2019-03-01
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Article
2
The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints
by
Min-Soo Kang
,
Do
-
Seok
Kim
,
Young-Eui Shin
Published 2019-03-01
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Article
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