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Eckart Schellkes
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Eckart Schellkes
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Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments
by
Jun-Hao Lee
,
Pin-Kuan Li
,
Hai-Wen Hung
,
Wallace Chuang
,
Eckart
Schellkes
,
Kiyokazu Yasuda
,
Jenn-Ming Song
Published 2021-06-01
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