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Geunyong Bak
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Geunyong Bak
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1
DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package
by
Muhammad Waqar
,
Geunyong
Bak
,
Junhyeong Kwon
,
Sanghyeon Baeg
Published 2021-01-01
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Article
2
DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball
by
Muhammad Waqar
,
Geunyong
Bak
,
Junhyeong Kwon
,
Sanghyeon Baeg
Published 2021-06-01
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Article
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