3D-Wafer Level Packaging approaches for MEMS by using Cu-based High Aspect Ratio Through Silicon Vias

by Hofmann, Lutz
Published 2017

Detailed Study of Copper Oxide ALD on SiO2, TaN, and Ru

by Waechtler, Thomas, Schulze, Steffen, Hofmann, Lutz, Hermann, Sascha, Roth, Nina, Schulz, Stefan E., Gessner, Thomas, Lang, Heinrich, Hietschold, Michael
Published 2009

Detailed Study of Copper Oxide ALD on SiO2, TaN, and Ru

by Waechtler, Thomas, Schulze, Steffen, Hofmann, Lutz, Hermann, Sascha, Roth, Nina, Schulz, Stefan E., Gessner, Thomas, Lang, Heinrich, Hietschold, Michael
Published 2009

ALD-grown seed layers for electrochemical copper deposition integrated with different diffusion barrier systems

by Waechtler, Thomas, Ding, Shao-Feng, Hofmann, Lutz, Mothes, Robert, Xie, Qi, Oswald, Steffen, Detavernier, Christophe, Schulz, Stefan E., Qu, Xin-Ping, Lang, Heinrich, Gessner, Thomas
Published 2011

Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems

by Mueller, Steve, Waechtler, Thomas, Hofmann, Lutz, Tuchscherer, Andre, Mothes, Robert, Gordan, Ovidiu, Lehmann, Daniel, Haidu, Francisc, Ogiewa, Marcel, Gerlich, Lukas, Ding, Shao-Feng, Schulz, Stefan E., Gessner, Thomas, Lang, Heinrich, Zahn, Dietrich R.T., Qu, Xin-Ping
Published 2012