Analysis of Noise Coupling From a Power Distribution Network to Signal Traces in High-Speed Multilayer Printed Circuit Boards

by Kim, Jingook, Rotaru, Mihai D, Baek, Seungyong, Park, Jongbae, Iyer, Mahadevan K, Kim, Joungho
Published 2006

Three-Dimensional System-in-Package Using Stacked Silicon Platform Technology

by Kripesh, Vaidyanathan, Yoon, Seung Wook, Ganesh, V. P., Khan, Navas, Rotaru, Mihai D, Fang, Wang, Iyer, Mahadevan
Published 2005

Next Generation of 100-μm-Pitch Wafer-Level Packaging and Assembly for Systems-on-Package

by Tay, Andrew, Iyer, Mahadevan, Tummala, Rao, Kripesh, V, Wong, E.H, Swaminathan, Madhavan, Wong, C.P, Rotaru, Mihai D., Doraiswami, Ravi, Ang, Simon
Published 2004