A New Alternative Electrochemical Process for a Pre-Deposited UPD-Mn Mediated the Growth of Cu(Mn) Film by Controlling the Time during the Cu-SLRR

by Jau-Shiung Fang, Yu-Fei Sie, Yi-Lung Cheng, Giin-Shan Chen
Published 2020-02-01

Electrical and Reliability Characteristics of Self-Forming Barrier for CuNd/SiOCH Films in Cu Interconnects

by Yi-Lung Cheng, Chih-Yen Lee, Wei-Fan Peng, Giin-Shan Chen, Jau-Shiung Fang
Published 2020-02-01

Tailoring Bandgap and Electrical Properties of Magnesium-Doped Aluminum Zinc Oxide Films Deposited by Reactive Sputtering Using Metallic Mg and Al–Zn Targets

by Li-Chung Yang, Der-Ru Jung, Fang-Ru Po, Chia-His Hsu, Jau-Shiung Fang
Published 2020-07-01

Electrical Characteristics and Reliability of Nitrogen-Stuffed Porous Low-<i>k</i> SiOCH/Mn₂O_3−xN/Cu Integration

by Yi-Lung Cheng, Yu-Lu Lin, Chih-Yen Lee, Giin-Shan Chen, Jau-Shiung Fang
Published 2019-10-01

Self-Assembled Monolayers on Highly Porous Low-<i>k</i> Dielectrics by 3-Aminopropyltrimethoxysilane Treatment

by Yi-Lung Cheng, Chiao-Wei Haung, Chih-Yen Lee, Giin-Shan Chen, Jau-Shiung Fang
Published 2019-04-01

Electrochemical Atomic Layer Deposition of Cu-Ru Film

by Ming-Yuan Hsu, 許名沅
Published 2014

RuOx Film as a Diffusion Barrier For Copper Metallization

by Han-Yu Wang, 王漢瑜
Published 2012

Preparation and Thermal Stability of the Cu3Ge film on Si Substrate by Reactive Magnetron Co-sputtering Using Copper and Germanium Metallic Targets

by cyuan-jian cai, 蔡銓洊
Published 2012

Hydrophobic and Oleophobic Fluorocarbon Films Prepared Using C4F8 and C3F8 Precursors

by Ching- Sau Lin, 林靜修
Published 2013

Fe-Co-B-Ti-Nb High Entropy Thin Film for Copper Metallization

by Yi-Chiun Li, 李逸群
Published 2010

Preparation and Properties of the Zinc Oxide andManganese-Doped Zinc Oxide by Chemical Bath Deposition

by Wei-Hsiang Luo, 駱煒翔
Published 2009

Ru as a diffusion barrier for sub-45-nm Cu contact plug

by Jia-Huei Lin, 林家輝
Published 2009

Preparation of Cu(Mn) Thin Films on Pattern Substratesby Electrochemical Atomic Layer Deposition

by Wei-Jhih Syu, 徐瑋志
Published 2016

Studies of Cu Thin Film by Electrochemical Atomic Layer Deposition on Pattern Substrates

by Guan-Ru Su, 蘇冠儒
Published 2015

Thermal Stability of Copper Film Prepared on a Tantalum Nitride/Tantalum Substrate by Electrochemical Atomic Layer Deposition

by Jain-Hao Chen, 陳建豪
Published 2015

Fabrication of GaN-based LED on Patterned-Si Substrates

by Wei-Syuan Weng, 翁唯軒
Published 2015

Characteristics of amorphous Ta-Si-C film as adiffusion barrier for copper metallization

by Wu-Jia Su, 蘇武加
Published 2010

Preparation of Silver-Copper Alloy Film by Electroplating and the Application of the Film on Metallization

by Kai-Min Chang, 張凱民
Published 2014

Studies of Cu(Mn) Thin Film by Electrochemical Atomic Layer Deposition (EC-ALD)

by Shih-Lung Sun, 孫世龍
Published 2014

Preparation and Characterisitics of Electrochemical Atomic Layer Deposited Copper-Silver Alloy Film on Interconnection

by Yiou-Hsin Liou, 柳耀翔
Published 2014