Development of Novel Lightweight Al-Rich Quinary Medium-Entropy Alloys with High Strength and Ductility

by Po-Sung Chen, Yu-Chin Liao, Yen-Ting Lin, Pei-Hua Tsai, Jason S. C. Jang, Ker-Chang Hsieh, Chih-Yen Chen, Jacob C. Huang, Hsin-Jay Wu, I-Yu Tsao
Published 2021-07-01

Development of Novel Lightweight Dual-Phase Al-Ti-Cr-Mn-V Medium-Entropy Alloys with High Strength and Ductility

by Yu-Chin Liao, Po-Sung Chen, Chao-Hsiu Li, Pei-Hua Tsai, Jason S. C. Jang, Ker-Chang Hsieh, Chih-Yen Chen, Ping-Hung Lin, Jacob C. Huang, Hsin-Jay Wu, Yu-Chieh Lo, Chang-Wei Huang, I-Yu Tsao
Published 2020-01-01

Phase diagram of Bi-Ga-Te and thermoelectric properties of Ga-doped Bi2Te3

by Chun-Han Lin, 林均翰
Published 2019

Phase diagram of ternary Zn-Sb-Ga system and Thermoelectric properties of Ga doped Zn4Sb3 alloys

by I-Lun Jen, 任毅倫
Published 2019

Ti-Al-Nb Phase Diagram Study at 800℃ and 1000℃

by Chia-Ju Huang, 黃家如
Published 2019

Zirconium Base Amorphous Alloy and Phase Diagram Study

by Wei-ren Chiang, 蔣偉仁
Published 2007

The Relationship of Sn Whisker Growth and Sn-plating Process

by Min-hsien Lu, 呂旻憲
Published 2007

Phase diagram study of Cu-Ti-Sn ternary system at 700 °C

by Po-chun Huang, 黃柏鈞
Published 2010

The Study of Phase Diagram, Diffusion Path and Diffusivities in Au-Al-Cu and Au-Al-Pd Systems Using Diffusion Couple Method

by Jyun-lin Li, 李俊霖
Published 2014

The Reliability Study of Cu Alloy Wire in Wire-bonding Process and the Study of Al-Cu-Pd Phase Diagram

by Chia-ai Chiu, 邱䕒僾
Published 2014

Phase Equilibrium Study of Fe-Al-Mn-C Dual Phase Steel

by Jhia-Liang Jhu, 朱家良
Published 2014

The directional solidification study of A356 aluminum alloy and Al-Si eutectic alloy

by Chia-Sin Lin, 林家新
Published 2014

The Study of Cu-Wire Bonding and BGA Solder Ball Joining

by Kuan-lin Huang, 黃冠霖
Published 2009

The joint study of BGA solder ball on the OSP type substrate

by Kuan-ting Lin, 林冠廷
Published 2009

The Study of Mechanism for Pb-free Solder Lift-off

by Hsiao-lan Su, 蘇曉蘭
Published 2009

Phase Diagram Study of Zr-Al-Si ternary system at 800 ℃

by Kuo-min Chen, 陳國敏
Published 2009

Wire bond failure Mechanism and microstructure analysis

by Herng-Shuoh Jang, 張恆碩
Published 2002

The Effects of Flame Retardant and Electrical Current on the Reliability of IC Package

by Chen-Town Huang, 黃建棟
Published 2002

The Study of Microstructure Analysis of Pb/Sn And Sn/Ag/Cu Solder Ball in BGA Package.

by Chin-Shu CHI, 杞金樹
Published 2001

Zr-Cu-Ni Phase Diagram at 800℃

by Chih-Hua Liu, 柳智華
Published 2004