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Khaoula Ait Belaid
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Khaoula Ait Belaid
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Khaoula Ait Belaid
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1
Numerical Laplace Inversion Method for Through-Silicon Via (TSV) Noise Coupling in 3D-IC Design
by
Khaoula
Ait
Belaid
,
Hassan Belahrach
,
Hassan Ayad
Published 2019-09-01
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Article
2
Investigation and Analysis of the Simultaneous Switching Noise in Power Distribution Network with Multi-Power Supplies of High Speed CMOS Circuits
by
Khaoula
Ait
Belaid
,
Hassan Belahrach
,
Hassan Ayad
Published 2017-01-01
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Article
3
Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling
by
Khaoula
Ait
Belaid
,
H. Belahrach
,
H. Ayad
Published 2021-01-01
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Article
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