Tensile Properties and Thermal Stability of Unidirectionally <111>-Oriented Nanotwinned and <110>-Oriented Microtwinned Copper

by Yu-Jin Li, King-Ning Tu, Chih Chen
Published 2020-03-01

Tensile Properties of <111>-Oriented Nanotwinned Cu with Different Columnar Grain Structures

by Yu-Jin Li, King-Ning Tu, Chih Chen
Published 2020-03-01

Intermetallic compounds in 3D integrated circuits technology: a brief review

by Syahira Annuar, Reza Mahmoodian, Mohd Hamdi, King-Ning Tu
Published 2017-12-01

Study of Ni Metallization in Macroporous Si Using Wet Chemistry for Radio Frequency Cross-Talk Isolation in Mixed Signal Integrated Circuits

by King-Ning Tu, Ya-Hong Xie, Kyuchul Chong, Chengkun Xu, Xi Zhang
Published 2011-05-01

Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints

by Jie-An Lin, Chung-Kuang Lin, Chen-Min Liu, Yi-Sa Huang, Chih Chen, David T. Chu, King-Ning Tu
Published 2016-01-01