Silver nanoparticle structures realized by digital surface micromachining

by Schmidt, Martin Arnold, Lam, Eric Wing-Jing, Li, Hanqing
Published 2010

Powder filling and sintering of 3D in-chip solenoid coils with high aspect ratio structure

by Huang, Yujia, Li, Haiwang, Sun, Jiamian, Zhai, Yanxin, Li, Hanqing, Xu, Tiantong
Published 2020

Broadband lumped-element parameter extraction method of two-port 3D MEMS in-chip solenoid inductors based on a physics-based equivalent circuit model

by Sun, Jiamian, Li, Haiwang, Wu, Sifan, Xu, Tiantong, Li, Hanqing, Wu, Hanxiao, Xia, Shuangzhi
Published 2020

BUILDING MANY-CORE PROCESSOR-TO-DRAM NETWORKS WITH MONOLITHIC CMOS SILICON PHOTONICS

by Batten, Christopher, Joshi, Ajay J., Orcutt, Jason Scott, Khilo, Anatol M., Moss, Benjamin Roy, Holzwarth, Charles W., Popovic, Milos, Li, Hanqing, Smith, Henry Ignatius, Hoyt, Judy L., Kaertner, Franz X., Ram, Rajeev J., Stojanovic, Vladimir Marko, Asanovic, Krste
Published 2010

Photonic integration in a commercial scaled bulk-CMOS process

by Kaertner, Franz X., Orcutt, Jason Scott, Khilo, Anatol M., Popovic, M. A., Holzwarth, Charles W., Li, Hanqing, Sun, J., Moss, Benjamin Roy, Dahlem, Marcus Vinicius Sobral, Ippen, Erich P., Hoyt, Judy L., Stojanovic, Vladimir Marko, Smith, Henry Ignatius, Ram, Rajeev J.
Published 2010