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Longteng Li
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Longteng Li
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Longteng Li
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1
Study on Establishing Degradation Model of Chip Solder Joint Material under Coupled Stress
by
Longteng
Li
,
Bo Jing
,
Jiaxing Hu
Published 2020-04-01
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Article
2
Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes
by
Longteng
Li
,
Bo Jing
,
Jiaxing Hu
,
Xiaoxuan Jiao
,
Jinxin Pan
,
Hongda Sun
Published 2020-01-01
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Article
3
A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature
by
Jiaxing Hu
,
Bo Jing
,
Yifeng Huang
,
Xiaoxuan Jiao
,
Meng Sun
,
Longteng
Li
Published 2020-01-01
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Article
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